Ansys Icepak®
Overview
Ansys Icepak® offers comprehensive solutions for thermal management in electronic systems, providing accurate and efficient simulations to predict and mitigate thermal issues.
This powerful tool enables engineers to model complex geometries, analyze heat transfer, and ensure the reliability of electronic components.
With Ansys Icepak®, you can accelerate product development, enhance performance, and reduce costs by addressing thermal challenges early in the design process.
Why Ansys Icepak®?
Accurate Thermal Analysis
Provides precise simulations of heat transfer, fluid flow, and temperature distribution in electronic devices.
Integration with CAD and EDA Tools
Seamlessly integrates with leading CAD and EDA tools for efficient data import and model setup.
Advanced Modeling Capabilities
Supports detailed modeling of complex geometries, including PCBs, heat sinks, and enclosures.
Comprehensive Material Library
Includes an extensive library of materials for accurate thermal property representation.
Automated Meshing and Solver Technology
Utilizes advanced meshing and solver technologies for faster and more accurate simulations.
Why partner with Simtec?
Partnering with Simtec ensures you fully leverage Ansys Icepak® through our expert support and comprehensive services.
- Superior Customer Support
- Training Services
- Consulting Services
- Cost-Effective Solutions
Applications Across Industries
Ansys Icepak® serves various industries by providing precise and reliable thermal simulations, enhancing product performance and longevity.
